A Photolithography Process Design for 5 nm Logic Process Flow
With the introduction of EUV lithography, the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process, the contact-poly pitch (CPP) is 44-50 nm, the minimum metal pitch (MPP) is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm (on product overlay).Althoug